The Methods of Calculation of Cutting Forces for Diamond Grinding of Brittle Optical Materials

This paper presents the methods of calculation of cutting forces when diamond grinding brittle optical materials. A model of the diamond grain and the grinding wheel surface is described. The methods of calculating the cutting forces acting on a single grain when operating in brittle fracture and quasi-plastic cutting modes are presented. The methods of calculating the depth of the fractured layer on the brittle surface after diamond grinding are described.  Limits on the value of the cutting forces are determined, taking into account the strength of the tool and diamond grain binding. These limits guarantee operation in the range of the preferential grain blunting mode and prevent grain fracture and dropout from the bond. This significantly increases durability of the cutting tool. The methods of calculating the total cutting force acting on the diamond grinding wheel are proposed. Recommendations are given on the diamond grinding modes for brittle optic materials to improve the surface quality (reduce roughness and fractured layer depth), and durability of the cutting tools.

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