Experimental Studies of Ultra-Precision Cutting Edge Machining of Silicon

Parts made from monocrystalline silicon are widely used in modern optical industry. These must meet high standards of precision and machining quality. Silicon belongs to the category of hard-to-machine brittle materials; however, under certain conditions, the material can be processed in ductile cutting mode. Cutters with monocrystalline cutting heads are used for machining. A literature review of ductile cutting methods and a data analysis of wear resistance of diamond cutters were performed. Based on the analytical review, a problem was formulated on the experimental determination of monocrystalline silicon cutting modes and the study of wear and durability of diamond cutters. The conducted experiments have shown the possibility of ductile machining of silicon. The data on wear resistance of diamond cutters with different geometry of the cutting head under different machining conditions was obtained.

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