An Analysis of Non-Destructive Methods for Thin Film Thickness Measurement
| Authors: Shupenev A.E., Pankova N.S., Korshunov I.S., Grigoriyants A.G. | Published: 15.04.2019 |
| Published in issue: #4(709)/2019 | |
| Category: Mechanical Engineering and Machine Science | Chapter: Methods and Devices for Monitoring and Diagnosing Materials, Products, Substances | |
| Keywords: thin film thickness, in situ methods, reflection high-energy electron diffraction, multiple-beam interferometry, gravimetric method |
The thickness of thin films determines the films’ unique properties, due to which they are widely used in optics and electronics. To measure the thickness of films in the range of 1 nm — 1 mcm during film deposition or on a finished product, it is important that non-destructive measurement methods should be used. An analysis of the most commonly used non-destructive methods for measuring and controlling the thickness of thin films is performed, with a possibility of in situ control of the technological process as well as for testing of finished products. This work describes theoretical and practical considerations of using reflection high-energy electron diffraction, piezoelectricity, interferometry and gravimetric methods for thin film thickness measurements. The results of the study can be used for selecting an optimal method of obtaining thin films when conducting theoretical and applied research.
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