Two-sided abrasive lapping of wafers taking into account laps wear

The problems connected with the accuracy of processing and the quality of the surface of monocrystals wafers for integrated microcircuits at two-sided abrasive lapping are considered. Both the wear of laps and the elastic contact of surfaces are taken into account. The formulas to calculate the restriction of the load application eccentricity on a part, changes of pressure in the processing region and the wear distribution on tool surfaces are provided. Two wear options of laps having different duration between working surfaces dressing are proved.